Integrated Circuit Mfg

Footnote

This classification applies to the manufacture of integrated circuits using semiconductor processing methods including, but not limited to thin film deposition, high temperature oxidation and diffusion, micron-range photo-lithography, and wet or dry etching. Each integrated circuit or wafer may contain tens of thousands of miniaturized electronic components, including but not limited to transistors, resistors, capacitors and diodes. This classification also applies to the manufacture of semiconductor wafers or chipsets consisting of grouped microchips.

This classification also applies to the hermetic packaging of integrated circuits within pin grid arrays.

The manufacture of transistors, resistors, capacitors, diodes or similar electronic components that are not contained on an integrated circuit chip or semiconductor wafer shall be classified as 3178, Electronic Element Mfg.

Also refer to companion Classification 8874(5), Integrated Circuit and Semiconductor Wafer Mfg. — hardware or software design or development.