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Classification Phraseology as of:
9/1/2023
 
Classification Code:
4112
 
Phraseology:

INTEGRATED CIRCUIT AND SEMICONDUCTOR WAFER MFG. — all other employees

Footnote:

This classification applies to the manufacture of integrated circuits using semiconductor processing methods including, but not limited to thin film deposition, high temperature oxidation and diffusion, micron-range photo-lithography, and wet or dry etching. Each integrated circuit or wafer may contain tens of thousands of miniaturized electronic components, including but not limited to transistors, resistors, capacitors and diodes. This classification also applies to the manufacture of semiconductor wafers or chipsets consisting of grouped microchips.

This classification also applies to the hermetic packaging of integrated circuits within pin grid arrays.

The manufacture of transistors, resistors, capacitors, diodes or similar electronic components that are not contained on an integrated circuit chip or semiconductor wafer shall be classified as 3178, Electronic Element Mfg.

Also refer to companion Classification 8874(5), Integrated Circuit and Semiconductor Wafer Mfg. — hardware or software design or development.

Industry Group/Related Classifications:
Electronics Industry
Approved Pure Premium Rate:
To learn how approved pure premium rates are different than insurer rates, click here.
Effective DatePure Premium RateNote
9/1/2023$0.31New/Renewal
9/1/2022$0.37New/Renewal
9/1/2021$0.39New/Renewal
Prior Phraseology and Footnote:
Shown below is the previously published phraseology and footnoteEffective Date

Phraseology:
INTEGRATED CIRCUIT AND SEMICONDUCTOR WAFER MFG.N330

Footnote:

This classification applies to the manufacture of integrated circuits using semiconductor processing methods, including but not limited to thin film deposition, high temperature oxidation and diffusion, micron-range photolithography, and wet or dry etching. Each integrated circuit or wafer may contain tens of thousands of miniaturized electronic components, including but not limited to transistors, resistors, capacitors and diodes. This classification also applies to the manufacture of semiconductor wafers or chipsets consisting of grouped microchips.

This classification also applies to the hermetic packaging of integrated circuits within pin grid arrays.

The manufacture of transistors, resistors, capacitors, diodes or similar electronic components that are not contained on an integrated circuit chip or semiconductor wafer shall be classified as 3178, Electronic Element Mfg.

9/1/2021
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